Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

Download:

Excel

Use~for the exact search match (i.e. ~NTS2101PT1).

11 Non-hybrid devices found

Non-hybrid devices

Page size:

1 - 11 of 11

Base part	Part	Status	HF	Mold Compound-Black												Lead Frame											Die Attach										Plating					Die		Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenol Resin [%]	Epoxy and Phenolic Resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Epoxy Phenol Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Magnesium (Mg) [%]	Tin (Sn) [%]	Zinc (Zn) [%]	Chromium (Cr) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Ethylene glycol dicyclopentenyl ether methacrylate [%]	Bis(a,a-dimethylbenzyl) Peroxide [%]	Epoxized Condensate Of Para-Hydrobenzaldehyde And Alkyl Phenol [%]	Silver (Ag) [%]	Epoxy resins [%]	Phenolic Resin-2 [%]	Aluminum Trioxide (Al2O3) [%]	Formaldehyde Polymer [%]	Weight [mg]	Tin (Sn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	40216-08-8	proprietary data	29690-82-2	proprietary data	7631-86-9	1333-86-4	21645-51-2	60676-86-0	9003-35-4	n/a	7440-22-4	7439-95-4	7440-31-5	7440-66-6	7440-47-3	7440-21-3	7440-02-0	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	68586-19-6	80-43-3	129915-35-1	7440-22-4	129915-35-1	54208-63-8	1344-28-1	9003-36-5	n/a	7440-31-5	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
74LCX245	74LCX245BQX	Active	Y					10			1.00171		88.9983		17.57			0.298403	0.105319	0.245743				99.3505		5.697					90		10			0.06		8.22785	86.7089	5.06329	0.158	100	0.438	100	0.397	24.32
74LCX245	74LCX245MTC	Active		9.5	5						0.5		85		40.867		0.15				0.65	3		96.2		30.624		3.5	0.65		95.85					0.136		2.7	95.5	1.8	0.223	100	1.25	100	0.496	73.596
74LCX245	74LCX245MTCX	Active		9.5	5						0.5		85		40.867		0.15				0.65	3		96.2		30.624		3.5	0.65		95.85					0.136		2.7	95.5	1.8	0.223	100	1.25	100	0.496	73.596
74LCX245	74LCX245WM	Last Shipments	Y					6			1		90	3	321.6	0.799907			0.149837				2.2802	96.6698	0.10028	171.52					72.5		27.5			0.4286	100				16.08	100	25.835	100	0.536	535.9996
74LCX245	74LCX245WMX	Last Shipments	Y					6			1		90	3	321.6	0.799907			0.149837				2.2802	96.6698	0.10028	171.52					72.5		27.5			0.4286	100				16.08	100	25.835	100	0.536	535.9996
MC74LCX245	MC74LCX245DTG	Active	Y	7.5			2.5			7.5	0.5		82		24.35				0.12				2.35	97.5	0.03	38.58	10				80				10	2.46		7.6	91	1.4	3.44	100	0.09	100	0.16	69.08
MC74LCX245	MC74LCX245DTR2G	Active	Y	7.5			2.5			7.5	0.5		82		24.35				0.12				2.35	97.5	0.03	38.58	10				80				10	2.46		7.6	91	1.4	3.44	100	0.09	100	0.16	69.08
MC74LCX245	MC74LCX245DWG	Active	Y						10.5				89.5		158.46	1			0.2				2.6	96.2		323.98					75	25				20.68	100				4.79	100	9.33	100	0.47	517.71
MC74LCX245	MC74LCX245DWR2G	Active	Y						10.5				89.5		158.46	1			0.2				2.6	96.2		323.98					75	25				20.68	100				4.79	100	9.33	100	0.47	517.71
MC74LCX245	MC74LCX245MNTWG	Active	Y			8					0.5	2	86.5	3	17.23	1		0.25	0.22	0.25				98.28		10.85				65				35		0.05	100				0.51	100	0.59	100	0.19	29.42
MC74LCX245	NLV74LCX245DTR2G	Last Shipments	Y	7.5			2.5			7.5	0.5		82		24.35				0.12				2.35	97.5	0.03	38.58	10				80				10	2.46		7.6	91	1.4	3.44	100	0.09	100	0.16	69.08

Page size:

1 - 11 of 11

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.