Material Composition

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8  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond - Au   TOTAL 
Epoxy resin
[%]
Phenolic Resin
[%]
Ortho Cresol Novolac Resin
[%]
Epoxy Phenol Resin
[%]
Silica Amorphous (SiO2)
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Phenolic Resin (Novolac)
[%]
Weight
[mg]
Silver (Ag)
[%]
Zinc (Zn)
[%]
Iron (Fe)
[%]
Copper (Cu)
[%]
Phosphorus (P)
[%]
Weight
[mg]
Epoxy resin
[%]
Silver (Ag)
[%]
Epoxy resins
[%]
Phenolic Resin-2
[%]
Formaldehyde Polymer
[%]
Weight
[mg]
Tin (Sn)
[%]
Palladium (Pd)
[%]
Nickel (Ni)
[%]
Gold (Au)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Weight
[mg]
proprietary data proprietary data 29690-82-2 proprietary data 7631-86-9 1333-86-4 60676-86-0 9003-35-4 n/a 7440-22-4 7440-66-6 7439-89-6 7440-50-8 7723-14-0 n/a proprietary data 7440-22-4 129915-35-1 54208-63-8 9003-36-5 n/a 7440-31-5 7440-05-3 7440-02-0 7440-57-5 n/a 7440-21-3 n/a 7440-57-5 n/a n/a
74AC245 74AC245MTC Active    Download xls Download xml Download xml Download xml  7.50   2.50         7.50   0.50   82.00      24.3500      0.12   2.35   97.50   0.03   38.5800   10.00   80.00         10.00   2.4600      7.60   91.00   1.40   3.4400   100.00   0.0900   100.00   0.1600   69.0800 
74AC245 74AC245MTCX Active    Download xls Download xml Download xml Download xml  7.50   2.50         7.50   0.50   82.00      40.8670      0.12   2.35   97.50   0.03   30.6240   10.00   80.00         10.00   0.1360      2.70   95.50   1.80   0.2230   100.00   1.2500   100.00   0.4960   73.5960 
74AC245 74AC245SC Obsolete  Y           No data available
74AC245 74AC245SCX Active  Y   Download xls Download xml Download xml Download xml        6.00         1.00   90.00   3.00   321.6000   0.80   0.15   2.28   96.67   0.10   171.5200      72.50      27.50      0.4286   100.00            16.0800   100.00   25.8350   100.00   0.5360   535.9996 
MC74AC245 MC74AC245DTG Active  Y   Download xls Download xml Download xml Download xml  7.50   2.50         7.50   0.50   82.00      24.3500      0.12   2.35   97.50   0.03   38.5800   10.00   80.00         10.00   2.4600      7.60   91.00   1.40   3.4400   100.00   0.0900   100.00   0.1600   69.0800 
MC74AC245 MC74AC245DTR2G Active  Y   Download xls Download xml Download xml Download xml  7.50   2.50         7.50   0.50   82.00      24.3500      0.12   2.35   97.50   0.03   38.5800   10.00   80.00         10.00   2.4600      7.60   91.00   1.40   3.4400   100.00   0.0900   100.00   0.1600   69.0800 
MC74AC245 MC74AC245DWG Active  Y   Download xls Download xml Download xml Download xml           10.50         89.50      158.4600   1.00   0.20   2.60   96.20      323.9800      75.00   25.00         20.6800   100.00            4.7900   100.00   9.3300   100.00   0.4700   517.7100 
MC74AC245 MC74AC245DWR2G Active  Y   Download xls Download xml Download xml Download xml           10.50         89.50      158.4600   1.00   0.20   2.60   96.20      323.9800      75.00   25.00         20.6800   100.00            4.7900   100.00   9.3300   100.00   0.4700   517.7100 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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