Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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8 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black								Lead Frame						Die Attach						Plating					Die		Wire Bond - Au		Lead Frame plating		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Epoxy Phenol Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Silver (Ag) [%]	Epoxy resins [%]	Phenolic Resin-2 [%]	Formaldehyde Polymer [%]	Weight [mg]	Tin (Sn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Silver (Ag) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	proprietary data	7631-86-9	1333-86-4	60676-86-0	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	7440-22-4	129915-35-1	54208-63-8	9003-36-5	n/a	7440-31-5	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	7440-22-4	n/a	n/a
74AC08	74AC08MTC	Last Shipments	Y	7.5	2.5			7.5	0.5	82	32.2		0.12	2.35	97.5	0.03	21.563		75	25			0.055		3.10559	95.0311	1.86335	0.161	100	0.496	100	0.348			54.823
74AC08	74AC08MTCX	Active	Y	5	2	2.5			0.5	90	32.2		0.12	2.35	97.5	0.03	21.563	10	80			10	0.055		3.10559	95.0311	1.86335	0.161	100	0.496	100	0.348			54.823
74AC08	74AC08SC	Last Shipments	Y			20.0002			1.00032	78.9994	81.974	0.0218309	0.125164	2.349	97.4225	0.081502	68.71		78.5		21.5		0.367		3.60169	94.3856	2.01271	0.944	100	3.63	100	0.3			155.925
74AC08	74AC08SCX	Active	Y	5	2	2.5			0.5	90	81.971		0.12	2.35	97.5	0.03	68.01	10	80			10	0.09	100				2.514	100	0.222	100	0.063	100	0.7	153.57
MC74AC08	MC74AC08DG	Active	Y				10.5			89.5	43.43	1.1	0.2	2.6	96.1		69.62		75	25			4.44	100				3.27	100	0.98	100	0.31			122.05
MC74AC08	MC74AC08DR2G	Active	Y				10.5			89.5	43.43	1.1	0.2	2.6	96.1		69.62		75	25			4.44	100				3.27	100	0.98	100	0.31			122.05
MC74AC08	MC74AC08DTR2G	Active	Y	5	2	2.5			0.5	90	19			1.9	98.1		22.54	10	80			10	1.44		7.6	91	1.4	0.04	100	2	100	0.22			45.24
MC74AC08	NLV74AC08DR2G	Last Shipments	Y				10.5			89.5	43.43	1.1	0.2	2.6	96.1		69.62		75	25			4.44	100				3.27	100	0.98	100	0.31			122.05

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.