Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

Download:

Excel

Use~for the exact search match (i.e. ~NTS2101PT1).

9 Non-hybrid devices found

Non-hybrid devices

Page size:

1 - 9 of 9

Base part	Part	Status	Mold Compound-Black					Lead Frame					Plating			Die		Wire Bond - Au		TOTAL
			Phenol Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Ortho-Cresol Novolac Resin [%]	Weight [mg]	Silver (Ag) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
			proprietary data	1333-86-4	60676-86-0	29690-82-2	n/a	7440-22-4	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
2N4401(LEGACY FAIRCHILD)	2N4401BU	Active	10.00	1.00	77.00	12.00	112.0000		0.10	99.87	0.03	100.9900	100.00	100.00	9.9500	100.00	0.0760	100.00	0.0760	223.0920
2N4401	2N4401G	Obsolete	No data available
2N4401	2N4401RLRA	Obsolete	No data available
2N4401	2N4401RLRAG	Obsolete	No data available
2N4401	2N4401RLRPG	Obsolete	No data available
2N4401(LEGACY FAIRCHILD)	2N4401TA	Active	10.00	1.00	77.00	12.00	112.0000	0.01	0.10	99.86	0.03	101.0000		100.00	5.8500	100.00	0.0750	100.00	0.0760	219.0010
2N4401(LEGACY FAIRCHILD)	2N4401TAR	Active	10.00	1.00	77.00	12.00	112.0000	0.01	0.10	99.86	0.03	101.0000		100.00	5.8500	100.00	0.0750	100.00	0.0760	219.0010
2N4401(LEGACY FAIRCHILD)	2N4401TF	Active	10.00	1.00	77.00	12.00	112.0000	0.01	0.10	99.86	0.03	101.0000		100.00	5.8500	100.00	0.0750	100.00	0.0760	219.0010
2N4401(LEGACY FAIRCHILD)	2N4401TFR	Active	10.00	1.00	77.00	12.00	112.0000	0.01	0.10	99.86	0.03	101.0000		100.00	5.8500	100.00	0.0750	100.00	0.0760	219.0010

Page size:

1 - 9 of 9

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.