Product Change Notification
| Change Notification # |
|
4958 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Transfer of 3 Lead Surface Mount (D2T) Package to Tesla |
| Issue Date |
|
1999-07-30 |
| Affected Product Family |
|
DISCRETES AND LOGIC |
| Description |
|
The three lead TO-220 for these devices already exists in Tesla assembly/test. This move will add the surface mount version which requires solder plating, and trim and form to be built in Tesla. DIFFERENCCES EXTERNALLY: (1) Solder plating is required on the heat sink surface, and leads. Tesla has only solder dip for the leads. Contract solder plating will be used at Tesla. (2) There is an assembly site difference. The existing assembly and test site for the (D2t) packages now is Kuala Lumpur, Malaysia, Motorola site. The new assembly/test site will be Tesla Sezam in Czech Republic. (3) An alternative mold CPD EME6600H production for the Tesla Assembly /Test site is expected to be qualified by mid November 1999.
|
| Key Items Affected by Change |
|
Motorola Assembly Site Subcontractor Assembly Site |
| |
| Key Milestones |
|
| Effective Date: |
|
1999-11-07 |
| Sample Info: |
|
Contact your local Motorola Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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