Product Change Notification
| Change Notification # |
|
4669 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Wafer Thickness Change for HSL and Fact Product Families |
| Issue Date |
|
1999-05-03 |
| Affected Product Family |
|
DISCRETES AND LOGIC |
| Description |
|
The wafer thickness for all Motorola MCW74HCxxx, MCW74HCTxxx, MCW74ACxxx, and MCW74ACT device types will change from 350um (14 mils) to 280um (11 mils). This change is required as Motorola migrates to thinner package types. All wafers with the new thickness of 280um will be identified with a label. If there is no thickness identified, the wafer is 350 um thick.
|
| Key Items Affected by Change |
|
Labeling Change On Shipping Pack |
| |
| Key Milestones |
|
| Effective Date: |
|
1999-08-11 |
| Sample Info: |
|
|
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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|