Product Change Notification
| Change Notification # |
|
20802Z |
| Revision |
|
|
| Type of Notification |
|
UPDATE NOTIFICATION |
| Change Title |
|
Update to FPCN20802Z - Qualification of Sumitomo mold compound from G700HC to G700HF |
| Issue Date |
|
2015-04-24 |
| Affected Product Family |
|
|
| Description |
|
FPCN20802Z announces the change in mold compound on selected devices in DPAK package from Sumitomo G700HC to G700HF to improve delamination at post area.
This UN is issued to correct the Change part identification date code identified in the FPCN. Products assembled with mold compound G700HF from ON Semiconductor facility in Seremban, Malaysia will have a Finish Good Date Code no earlier than WW08, 2016.
|
| Key Items Affected by Change |
|
Material Change |
| |
| Key Milestones |
|
| Effective Date: |
|
2016-02-25 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Ahmad Faris Dzulkipli |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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|