Product Change Notification
| Change Notification # |
|
20626 |
| Revision |
|
CB |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
FPCN for wire change from AU to CU, mold compound change & part number change |
| Issue Date |
|
2014-12-26 |
| Affected Product Family |
|
|
| Description |
|
This is a Final Process Change Notification to announce for below contents.
1) Changing wire material from gold to copper
2) Changing part number from XXXXXX-TL-H to XXXXXX-TL-W.
(See the list of models)
|
| Key Items Affected by Change |
|
Assembly area- Wire Bonding and Mold compound and Part number change |
| |
| Key Milestones |
|
| Effective Date: |
|
2015-04-02 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|