Product Change Notification
| Change Notification # |
|
20626 |
| Revision |
|
BK |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
FPCN for wire change from gold to copper, mold compound and part number change. |
| Issue Date |
|
2015-04-03 |
| Affected Product Family |
|
|
| Description |
|
This is a Final Process Change Notification to announce for below contents.
1) Changing wire material from gold to copper
2) Changing part number from CPH6442-TL-E to CPH6442-TL-W.
3) Changing mold compound from halide to halide free.
|
| Key Items Affected by Change |
|
AssembChange & Material Change |
| |
| Key Milestones |
|
| Effective Date: |
|
2015-07-10 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|