feedback
Rate this webpage

Need
Support?


Product Change Notification

Change Notification #   20802
Revision   Z
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Qualification of Sumitomo mold compound from G700HC to G700HF
Issue Date   2015-02-25
Affected Product Family  
Description   To notify customers of the change in mold compound on selected devices in DPAK package from Sumitomo G700HC to G700HF. The change is to improve delamination at post area.
Key Items Affected by Change   Material Change
 
Key Milestones  
Effective Date:   2016-02-25
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

Previously Viewed Products
Clear List

Technical Support
   
 

Sign Up for Ongoing PCN Updates!
  ON Semiconductor has partnered with PCNAlert to provide product change and product update notification. This service will automatically notify you of time critical product change and obsolescence information. You can customize your preferences, so you only receive PCNs for products you specify.

This is a complimentary service from ON Semiconductor and PCNAlert.