Product Change Notification
| Change Notification # |
|
20802 |
| Revision |
|
Z |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualification of Sumitomo mold compound from G700HC to G700HF |
| Issue Date |
|
2015-02-25 |
| Affected Product Family |
|
|
| Description |
|
To notify customers of the change in mold compound on selected devices in DPAK package from Sumitomo G700HC to G700HF. The change is to improve delamination at post area.
|
| Key Items Affected by Change |
|
Material Change |
| |
| Key Milestones |
|
| Effective Date: |
|
2016-02-25 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|