Product Change Notification
| Change Notification # |
|
20626 |
| Revision |
|
BJ |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
FPCN for wire change from AU to CU and part number change. |
| Issue Date |
|
2015-02-03 |
| Affected Product Family |
|
|
| Description |
|
This is a Final Process Change Notification to announce for below contents.
1) Changing wire material from gold to copper
2) Changing part number from XXXXXX-TL-H to XXXXXX-TL-W.
(See the list of models)
The product design and electrical specifications will remain identical. A full electrical characterization over the temperature range will be performed for each product to check the device functionality and electrical specifications. Qualification tests are designed to show that the reliability of transferred devices will continue to meet or exceed ON Semiconductor standards.
|
| Key Items Affected by Change |
|
Assembly area- Wire Bonding and Mold compound and Part number change |
| |
| Key Milestones |
|
| Effective Date: |
|
2015-05-10 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|