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Product Change Notification

Change Notification #   20626
Revision   BF
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   FPCN for wire change from AU to CU, mold compound change & part number change
Issue Date   2014-11-11
Affected Product Family  
Description   This is a Final Process Change Notification to announce for below contents. 1) Changing wire material from gold to copper 2) Changing part number from XXXXXX-TL-H or XXXXXX-TL-E to XXXXXX-TL-W. (See the list of models) 3) Changing mold compound from halide to halide free, in case of changing from XXXXXX-TL-E to XXXXXX-TL-W. There is no change in case of changing from XXXXXX-TL-H to XXXXXX-TL-W. The product design and electrical specifications will remain identical. A full electrical characterization over the temperature range will be performed for each product to check the device functionality and electrical specifications. Qualification tests are designed to show that the reliability of transferred devices will continue to meet or exceed ON Semiconductor standards.
Key Items Affected by Change   Assembly area- Wire Bonding and Mold compound and Part number change
 
Key Milestones  
Effective Date:   2015-02-11
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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