Product Change Notification
| Change Notification # |
|
20283 |
| Revision |
|
|
| Type of Notification |
|
UPDATE NOTIFICATION |
| Change Title |
|
Qualification of NCP330, NCP340, and NCP341 with Palladium Coated Copper Wire |
| Issue Date |
|
2014-08-02 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor first issued FPCN20283 on October 30, 2013 announcing the qualification of Copper Wire for the NCP330MUTBG & NCP340MUTBG at ON Semiconductor’s Seremban, Malaysia facility. UN20283 is an update notification informing our customers of the qualification of Palladium Coated Copper Wire for these devices at the same facility.
The NCP330, NCP340, and NCP341 are currently assembled at the ON Semiconductor Seremban, Malaysia facility with Au Wire. Upon the expiration of UN20283 or earlier with customer approval, these devices will be assembled with Palladium Coated Copper Wire. There is no change in package outline or electrical performance of the parts – they continue to fully meet datasheet specifications.
|
| Key Items Affected by Change |
|
Assembly Process |
| |
| Key Milestones |
|
| Effective Date: |
|
2014-11-02 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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|