Product Change Notification
| Change Notification # |
|
20289 |
| Revision |
|
|
| Type of Notification |
|
UPDATE NOTIFICATION |
| Change Title |
|
Update to IPCN20289 - Qual ATP as alt source for SOIC 8lds using Cu wire |
| Issue Date |
|
2014-03-07 |
| Affected Product Family |
|
|
| Description |
|
This update is issued to remove the qualification of ATP as alternate source for SOIC 8lds using Cu wire for ONC35EE wafer technology. We will not proceed with using ATP as an additional supplier for the part numbers listed below.
|
| Key Items Affected by Change |
|
Assembly bill of materials such as epoxy, gold wire and mold compound. |
| |
| Key Milestones |
|
| Effective Date: |
|
2014-03-07 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|