Product Change Notification
| Change Notification # |
|
20386 |
| Revision |
|
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| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qual of OSV for ASY&TST of TMOS, HD3E, HVFET, SCR and TRIAC packaged in DPAK |
| Issue Date |
|
2014-02-20 |
| Affected Product Family |
|
|
| Description |
|
This FPCN announces the planned capacity expansion of ON Semiconductor’s assembly and test operations of DPAK discrete packaged products, currently built at ON Semiconductor Seremban, Malaysia facility to ON Semiconductor Vietnam (OSV).
Upon the expiration of this FPCN, Trench Mosfet, Ultrafast Rectifier, Bipolar Power Transistor devices may be processed at either location. These products have been qualified to commodity/commercial requirements. These products will continue being Pb-free, Halide free and RoHS compliant.
|
| Key Items Affected by Change |
|
ON Semiconductor Assembly & Test |
| |
| Key Milestones |
|
| Effective Date: |
|
2014-05-20 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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