Product Change Notification
| Change Notification # |
|
20289 |
| Revision |
|
|
| Type of Notification |
|
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualify ATP as alternate source for SOIC 8lds using Cu wire for ONC35EE wafer technology. |
| Issue Date |
|
2013-12-04 |
| Affected Product Family |
|
|
| Description |
|
Qualify Amkor Philippines Plant 1 as alternate assembly source using Cu wire for SOIC 8L ONC35EE wafer technology. Purpose of this is to have alternate assembly subcon using Cu wire instead of existing of Au wire. Details of bill of materials as follows:
|
| Key Items Affected by Change |
|
Assembly bill of materials such as epoxy, gold wire and mold compound. |
| |
| Key Milestones |
|
| Effective Date: |
|
2014-04-04 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|