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Product Change Notification

Change Notification #   16658
Revision   B
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Sourcing MOSFET Die from United Microelectronics Corporation
Issue Date   2012-08-16
Affected Product Family  
Description   ON Semiconductor is already utilizing United Microelectronics Corp (UMC) for their High Cell Density (HD3e) and Trench (T2) MOSFET technology silicon platforms. A fraction of the Trench (T1) MOSFET portfolio started to use UMC Wafer Fab July 2012 per FPCN #16658 and FPCN #16658A. With additional qualification and electrical characterization of this silicon platform, more T1 products will be built with Die sourced from the UMC. Wafer starts of this third group of products will begin in November 2012. Reliability Qualification and full electrical characterization over temperature have been performed, and available upon request.
Key Items Affected by Change   Wafer Fabrication
 
Key Milestones  
Effective Date:   2012-11-18
Sample Info:   Contact your local ON Semiconductor Sales Office or Brian Goodburn
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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