Product Change Notification
| Change Notification # |
|
16658 |
| Revision |
|
B |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Sourcing MOSFET Die from United Microelectronics Corporation |
| Issue Date |
|
2012-08-16 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor is already utilizing United Microelectronics Corp (UMC) for their High Cell Density (HD3e) and Trench (T2) MOSFET technology silicon platforms.
A fraction of the Trench (T1) MOSFET portfolio started to use UMC Wafer Fab July 2012 per FPCN #16658 and FPCN #16658A. With additional qualification and electrical characterization of this silicon platform, more T1 products will be built with Die sourced from the UMC. Wafer starts of this third group of products will begin in November 2012.
Reliability Qualification and full electrical characterization over temperature have been performed, and available upon request.
|
| Key Items Affected by Change |
|
Wafer Fabrication |
| |
| Key Milestones |
|
| Effective Date: |
|
2012-11-18 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Brian Goodburn |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|