Product Change Notification
| Change Notification # |
|
16658 |
| Revision |
|
A |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Sourcing MOSFET Die from United Microelectronics Corporation |
| Issue Date |
|
2012-02-01 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor is already utilizing United Microelectronics Corp (UMC) for their High Cell Density (HD3e) and Trench (T2) MOSFET technology silicon platforms.
A fraction of the Trench (T1) MOSFET portfolio will start using UMC Wafer Fab, March 2012 per FPCN #16658. With additional qualification and electrical characterization of this silicon platform, more T1 products will be built with Die sourced from the UMC. Wafer starts of this second group of products will begin in May 2012.
|
| Key Items Affected by Change |
|
PowerFET Business Unit |
| |
| Key Milestones |
|
| Effective Date: |
|
2012-05-01 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Brian Goodburn |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|