Product Change Notification
| Change Notification # |
|
16724 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT BULLETIN |
| Change Title |
|
SOT 223 VHVIC MSL Change from 3 to 1 |
| Issue Date |
|
2011-09-13 |
| Affected Product Family |
|
|
| Description |
|
SOT 223 VHVIC continuous improvement activity which enabled the change from MSL3 260 degree C to MSL1 260 degree C.
|
| Key Items Affected by Change |
|
Die bond epoxy material |
| |
| Key Milestones |
|
| Effective Date: |
|
2011-10-06 |
| Sample Info: |
|
Contact your local ON Semiconductor sales office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|