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Product Change Notification

Change Notification #   16724
Revision  
Type of Notification   PRODUCT BULLETIN
Change Title   SOT 223 VHVIC MSL Change from 3 to 1
Issue Date   2011-09-13
Affected Product Family  
Description   SOT 223 VHVIC continuous improvement activity which enabled the change from MSL3 260 degree C to MSL1 260 degree C.
Key Items Affected by Change   Die bond epoxy material
 
Key Milestones  
Effective Date:   2011-10-06
Sample Info:   Contact your local ON Semiconductor sales office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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