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Product Change Notification

Change Notification #   16678
Revision   O
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   IC D2PAK 3 LEAD CHANGE TO SINGLE GAGE THICKNESS HEAT SINK
Issue Date   2011-07-15
Affected Product Family  
Description   This is the Final PCN to Initial Product Change Notice IPCN#16396 (available at www.onsemi.com) to notify customers the D2PAK 3 lead product lines for IC products running in Seremban, Malaysia have been qualified for a single gage thickness heat sink. The current heat sink has a thickness of .050 inch (1.265 mm). The new heat sink will have a thickness of .020 inch (.508 mm). Full reliability and characterization has been completed successfully. Thermal analysis comparing differences between the two thickness heat sinks indicate insignificant difference in performance. Report is available upon request. The new heat sink dimensions are in compliance with the standard JEDEC specification T0-263 issue E. Package designator R-PSFM. Product samples are available now.
Key Items Affected by Change   Package Change
 
Key Milestones  
Effective Date:   2011-10-15
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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