Product Change Notification
| Change Notification # |
|
16678 |
| Revision |
|
O |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
IC D2PAK 3 LEAD CHANGE TO SINGLE GAGE THICKNESS HEAT SINK |
| Issue Date |
|
2011-07-15 |
| Affected Product Family |
|
|
| Description |
|
This is the Final PCN to Initial Product Change Notice IPCN#16396 (available at www.onsemi.com) to notify customers the D2PAK 3 lead product lines for IC products running in Seremban, Malaysia have been qualified for a single gage thickness heat sink. The current heat sink has a thickness of .050 inch (1.265 mm). The new heat sink will have a thickness of .020 inch (.508 mm).
Full reliability and characterization has been completed successfully. Thermal analysis comparing differences between the two thickness heat sinks indicate insignificant difference in performance. Report is available upon request.
The new heat sink dimensions are in compliance with the standard JEDEC specification T0-263 issue E. Package designator R-PSFM.
Product samples are available now.
|
| Key Items Affected by Change |
|
Package Change |
| |
| Key Milestones |
|
| Effective Date: |
|
2011-10-15 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|