Product Change Notification
| Change Notification # |
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16618 |
| Revision |
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| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Additional Wafer Capacity Expansion at United Microelectronics Corporation |
| Issue Date |
|
2011-04-01 |
| Affected Product Family |
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| Description |
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Referencing the ON Semiconductor Initial Product/Process Change Notification#16391: Wafer Capacity Expansion. This is the Final Process Change Notification.
ON Semiconductor is continuing to add more wafer fabrication capacity of their Trench2 (T2) MOSFET technology silicon platform. This has been accomplished by completing more qualification of United Microelectronics Corp (UMC), a wafer fabrication facility located in Taiwan. During early 2011, additional starts of Trench technology will begin at UMC.
|
| Key Items Affected by Change |
|
Wafer Fabrication |
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| Key Milestones |
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| Effective Date: |
|
2011-07-01 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Brian Goodburn |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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