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Product Change Notification

Change Notification #   16618
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Additional Wafer Capacity Expansion at United Microelectronics Corporation
Issue Date   2011-04-01
Affected Product Family  
Description   Referencing the ON Semiconductor Initial Product/Process Change Notification#16391: Wafer Capacity Expansion. This is the Final Process Change Notification. ON Semiconductor is continuing to add more wafer fabrication capacity of their Trench2 (T2) MOSFET technology silicon platform. This has been accomplished by completing more qualification of United Microelectronics Corp (UMC), a wafer fabrication facility located in Taiwan. During early 2011, additional starts of Trench technology will begin at UMC.
Key Items Affected by Change   Wafer Fabrication
 
Key Milestones  
Effective Date:   2011-07-01
Sample Info:   Contact your local ON Semiconductor Sales Office or Brian Goodburn
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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