Product Change Notification
| Change Notification # |
|
16539 |
| Revision |
|
O |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Wafer Capacity Expansion at United Microelectronics Corporation (UMC) |
| Issue Date |
|
2010-12-01 |
| Affected Product Family |
|
|
| Description |
|
Referencing the Final Product/Process Change Notice #16391: Wafer Capacity Expansion at United Microelectronics Corporation (UMC).
This is a subsequent announcement to Customers that all the remaining High Cell Density (HD3e) MOSFET products can have Die sourced from either ON Semiconductor’s Wafer facility in Aizu, Japan, or from a Wafer Foundry, United Microelectronics Corporation located in Taiwan.
Reliability Qualification and full electrical characterization over temperature have been performed.
|
| Key Items Affected by Change |
|
Wafer Fabrication |
| |
| Key Milestones |
|
| Effective Date: |
|
2011-03-07 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Brian Goodburn |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|