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Product Change Notification

Change Notification #   16539
Revision   O
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Wafer Capacity Expansion at United Microelectronics Corporation (UMC)
Issue Date   2010-12-01
Affected Product Family  
Description   Referencing the Final Product/Process Change Notice #16391: Wafer Capacity Expansion at United Microelectronics Corporation (UMC). This is a subsequent announcement to Customers that all the remaining High Cell Density (HD3e) MOSFET products can have Die sourced from either ON Semiconductor’s Wafer facility in Aizu, Japan, or from a Wafer Foundry, United Microelectronics Corporation located in Taiwan. Reliability Qualification and full electrical characterization over temperature have been performed.
Key Items Affected by Change   Wafer Fabrication
 
Key Milestones  
Effective Date:   2011-03-07
Sample Info:   Contact your local ON Semiconductor Sales Office or Brian Goodburn
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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