Product Change Notification
| Change Notification # |
|
16271 |
| Revision |
|
A |
| Type of Notification |
|
UPDATE NOTIFICATION |
| Change Title |
|
Update to Final Notification for transfer of products from MOS9 wafer fab (East Kilbride, Scotland) to CZ4 wafer fab (Roznov, Czech Republic). |
| Issue Date |
|
2010-11-19 |
| Affected Product Family |
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| Description |
|
This is an update to FPCN16271 which is available at www.onsemi.com ON Semiconductor.
MOS9 wafer fab will no longer support the fabrication of the E-Plus ECL translators. In order to continue to support our customer’s requirements for E-Plus ECL Translator products, the fabrication of these devices is being moved from current wafer fab, MOS9 in East Kilbride Scotland, to ON Semiconductor’s wafer fab, CZ4 in Roznov Czech Republic.
In the course of reviewing the electrical data, Test Methodology improvements indicate prior limits were imprecisely set along with differences observed during evaluation comparison of MOS9 and CZ4. The following changes will be made in the Data Sheet:
For NB100ELT23L:
Change ICCH Limits at all temperatures from (10mA, 20mA) to (10mA, 30mA)
Change ICCL Limits at all temperatures from (15mA, 25mA) to (15mA, 35mA)
Change Tpd Limits change from (1.95ns, 2.95ns) to (1.55ns, 2.95ns) across temperature range.
Change Tr Limits change from (700ps, 1650ps) to (700ps, 1700ps) across temperature range.
Change Tf Limits change from (300ps, 1000ps) to (300ps, 1250ps) across temperature range.
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| Key Items Affected by Change |
|
ON Semiconductor wafer fab site |
| |
| Key Milestones |
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| Effective Date: |
|
2010-12-12 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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