Product Change Notification
| Change Notification # |
|
16516 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Notification of Qualification of Carsem for Assembly for 28 Lead TSSOP Wide Body Packages |
| Issue Date |
|
2010-08-24 |
| Affected Product Family |
|
|
| Description |
|
Process Change Notice to notify customers of the capacity expansion of the ON Semiconductor assembly for 28 Lead TSSOP Wide Body Packages at Carsem located Perak, Malaysia. The devices listed on this FPCN have historically been assembled at the Amkor located in Laguna, Philippines. At the expiration of this Final PCN, these devices may be processed at either location. This is not a transfer but a capacity expansion.
|
| Key Items Affected by Change |
|
ON Semiconductor Assembly |
| |
| Key Milestones |
|
| Effective Date: |
|
2010-12-24 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|