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Product Change Notification

Change Notification #   16516
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Notification of Qualification of Carsem for Assembly for 28 Lead TSSOP Wide Body Packages
Issue Date   2010-08-24
Affected Product Family  
Description   Process Change Notice to notify customers of the capacity expansion of the ON Semiconductor assembly for 28 Lead TSSOP Wide Body Packages at Carsem located Perak, Malaysia. The devices listed on this FPCN have historically been assembled at the Amkor located in Laguna, Philippines. At the expiration of this Final PCN, these devices may be processed at either location. This is not a transfer but a capacity expansion.
Key Items Affected by Change   ON Semiconductor Assembly
 
Key Milestones  
Effective Date:   2010-12-24
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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