Product Change Notification
| Change Notification # |
|
16491 |
| Revision |
|
O |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
MSOP 8/10 Lead Package Moisture Sensitivity Level Change |
| Issue Date |
|
2010-06-24 |
| Affected Product Family |
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| Description |
|
The package kit for the current 8 and 10ld MSOP BOM has been changed to “Green” - Halogen Free mold compound and as a result the Moisture Sensitivity Level (MSL) rating will change to MSL1 from MSL3. The package will be rated at MSL-1 at 260°C solder reflow temperature as opposed to MSL-3 at 260°C per J-STD-020 requirements. Thus dry packing will not be required for shipments.
This new package kit will be effective from date code 1040 (year 2010, work week 40) onwards.
There is no change to physical dimensions for the package.
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| Key Items Affected by Change |
|
Computer Products – Power Switching Group |
| |
| Key Milestones |
|
| Effective Date: |
|
2010-10-04 |
| Sample Info: |
|
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| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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