Product Change Notification
| Change Notification # |
|
16225 |
| Revision |
|
|
| Type of Notification |
|
UPDATE NOTIFICATION |
| Change Title |
|
Copper Wire in the S08 and Micro 8 Flat Lead Packages for MOSFET Products |
| Issue Date |
|
2010-03-25 |
| Affected Product Family |
|
|
| Description |
|
Referencing the ON Semiconductor General Announcement #GA16200 and FPCN #16225: Conversion of Gold wire to Copper wire in ON Semiconductor's Assembly Facilities.
ON Semiconductor is notifying customers of its use of Copper Wire (in place of Gold Wire) for additional S08 Flat Lead and Micro8 Flat Lead products assembled with MOSFET Die. MOSFET Product types built in these two packages are represented by this Process Change Notice.
The mold compound, die attach, lead frame, and clip materials used for these Packages will not be changed. Reliability Qualification and full electrical characterization over temperature have been performed.
|
| Key Items Affected by Change |
|
ON Semiconductor SO8 Flat Lead, Micro8 Assembly Areas – Wire Bon |
| |
| Key Milestones |
|
| Effective Date: |
|
2010-06-25 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Brian Goodburn |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|