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Product Change Notification

Change Notification #   16225
Revision  
Type of Notification   UPDATE NOTIFICATION
Change Title   Copper Wire in the S08 and Micro 8 Flat Lead Packages for MOSFET Products
Issue Date   2010-03-25
Affected Product Family  
Description   Referencing the ON Semiconductor General Announcement #GA16200 and FPCN #16225: Conversion of Gold wire to Copper wire in ON Semiconductor's Assembly Facilities. ON Semiconductor is notifying customers of its use of Copper Wire (in place of Gold Wire) for additional S08 Flat Lead and Micro8 Flat Lead products assembled with MOSFET Die. MOSFET Product types built in these two packages are represented by this Process Change Notice. The mold compound, die attach, lead frame, and clip materials used for these Packages will not be changed. Reliability Qualification and full electrical characterization over temperature have been performed.
Key Items Affected by Change   ON Semiconductor SO8 Flat Lead, Micro8 Assembly Areas – Wire Bon
 
Key Milestones  
Effective Date:   2010-06-25
Sample Info:   Contact your local ON Semiconductor Sales Office or Brian Goodburn
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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