Product Change Notification
| Change Notification # |
|
16391 |
| Revision |
|
O |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Wafer Capacity Expansion |
| Issue Date |
|
2010-03-18 |
| Affected Product Family |
|
|
| Description |
|
Referencing the ON Semiconductor ON Semiconductor Initial Product/Process Change Notification #16391: Wafer Capacity Expansion. This is the Final Process Change Notification.
ON Semiconductor is adding wafer fabrication capacity for their High Cell Density (HD3e) and Trench (T2) MOSFET technology silicon platforms. This will be accomplished by qualifying United Microelectronics Corp (UMC), a wafer fabrication facility located in Taiwan. During early 2010, Wafer starts of both Trench and HD3e Silicon technologies will begin at UMC.
|
| Key Items Affected by Change |
|
Wafer Fabrication |
| |
| Key Milestones |
|
| Effective Date: |
|
2010-06-18 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|