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Product Change Notification

Change Notification #   16391
Revision  
Type of Notification   INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Wafer Capacity Expansion for High Cell Density (HD3e) and Trench (T1 & T2) MOSFETs
Issue Date   2010-02-02
Affected Product Family  
Description   This is an Initial Process Change Notification. ON Semiconductor is adding wafer fabrication capacity for their High Cell Density (HD3e) and Trench (T1 & T2) MOSFET technology silicon platforms. This will be accomplished by qualifying United Microelectronics Corp (UMC), a wafer fabrication facility located in Taiwan. By the middle of 2010, Wafer starts of both Trench and HD3e Silicon technologies will begin at UMC.
Key Items Affected by Change   Wafer Fabrication
 
Key Milestones  
Effective Date:   2010-06-02
Sample Info:   Contact Your Local On semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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