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Product Change Notification

Change Notification #   16382
Revision   O
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   2N7002L Product types with Trench Die
Issue Date   2010-01-14
Affected Product Family  
Description   ON Semiconductor is sending out this notification to announce that a Die technology change is occurring for the 2N7002L product types. Currently, the 2N7002L is built with a Planar design. With this change, we will replace the existing Die with our Trench Die design.
Key Items Affected by Change   Wafer Process going from a Planar to a Trench Design
 
Key Milestones  
Effective Date:   2010-04-14
Sample Info:   Contact your local ON Semiconductor Sales Office or Brian Goodburn < brian.goodburn@onsemi.com >
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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