Product Change Notification
| Change Notification # |
|
16382 |
| Revision |
|
O |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
2N7002L Product types with Trench Die |
| Issue Date |
|
2010-01-14 |
| Affected Product Family |
|
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| Description |
|
ON Semiconductor is sending out this notification to announce that a Die technology change is occurring for the 2N7002L product types. Currently, the 2N7002L is built with a Planar design. With this change, we will replace the existing Die with our Trench Die design.
|
| Key Items Affected by Change |
|
Wafer Process going from a Planar to a Trench Design |
| |
| Key Milestones |
|
| Effective Date: |
|
2010-04-14 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Brian Goodburn < brian.goodburn@onsemi.com > |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|