Product Change Notification
| Change Notification # |
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16380 |
| Revision |
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| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Addition of ON Semiconductor Gresham Fab for CAT34C02 2K bit I2C SPD EEPROM |
| Issue Date |
|
2009-12-18 |
| Affected Product Family |
|
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| Description |
|
This change allows the addition of the ON Semiconductor wafer manufacturing facility in Gresham, Oregon, USA, (“Gresham”) to provide internal additional capacity. The current CAT34C02 product is fabricated at the OKI Semiconductor, Japan 6-inch Fab in a 0.35um CMOS process. The new CAT34C02 die will be fabricated at the Gresham 8-inch Fab in a 0.35um CMOS process. This will provide increased die capacity to meet our growing demand, while maintaining 100% backward compatibility to the previous CAT34C02 die revision.
|
| Key Items Affected by Change |
|
CAT34C02 all packages, all temperatures |
| |
| Key Milestones |
|
| Effective Date: |
|
2009-03-01 |
| Sample Info: |
|
CAT34C02 in TSSOP and TDFN packages available: January 20, 2010 |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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