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Product Change Notification

Change Notification #   16380
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Addition of ON Semiconductor Gresham Fab for CAT34C02 2K bit I2C SPD EEPROM
Issue Date   2009-12-18
Affected Product Family  
Description   This change allows the addition of the ON Semiconductor wafer manufacturing facility in Gresham, Oregon, USA, (“Gresham”) to provide internal additional capacity. The current CAT34C02 product is fabricated at the OKI Semiconductor, Japan 6-inch Fab in a 0.35um CMOS process. The new CAT34C02 die will be fabricated at the Gresham 8-inch Fab in a 0.35um CMOS process. This will provide increased die capacity to meet our growing demand, while maintaining 100% backward compatibility to the previous CAT34C02 die revision.
Key Items Affected by Change   CAT34C02 all packages, all temperatures
 
Key Milestones  
Effective Date:   2009-03-01
Sample Info:   CAT34C02 in TSSOP and TDFN packages available: January 20, 2010
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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