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Product Change Notification

Change Notification #   16361
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Addition of ON Semiconductor Gresham Fab for CAT24C02 2K-bit I2C Serial EEPROM
Issue Date   2009-11-13
Affected Product Family  
Description   This change allows the addition of the ON Semiconductor wafer manufacturing facility in Gresham, Oregon, USA, (“Gresham”) to provide internal additional capacity. The current CAT24C02 product is fabricated at the OKI Semiconductor, Japan 6-inch Fab in a 0.35um CMOS process. The new CAT24C02 die will be fabricated at the Gresham 8-inch Fab in a 0.35um CMOS process. This will provide increased die capacity to meet our growing demand, while maintaining 100% backward compatibility to the previous CAT24C02 die revision. The CAT24C02 Gresham die will be assembled in fully RoHS-compliant packages at the ON Semiconductor facility, OSPI – Philippines (SOIC packages) and at existing external assembly contractors, UTAC - Thailand and STARS – Thailand (all packages).
Key Items Affected by Change   CAT24C02 (all packages, all temperatures)
 
Key Milestones  
Effective Date:   2010-01-01
Sample Info:   CAT24C02 in SOIC and TSSOP packages available: November 25, 2009 For other packages samples availability, see Affected Device List on Page #3. Contact your local ON Semiconductor Sales Office.
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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