feedback
Rate this webpage

Need
Support?


Product Change Notification

Change Notification #   16346
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Solder Die Attach for the SOT223 Package
Issue Date   2009-10-15
Affected Product Family  
Description   This is a Final Product Change Notice for using a soft solder Die attach material for the SOT223 package. The material change will be going from an Epoxy to a Solder for Die attach. This FPCN is being issued for MOSFET, Thyristor, and Smart Discrete products.
Key Items Affected by Change   Die Attach Assembly
 
Key Milestones  
Effective Date:   2009-01-15
Sample Info:   Contact your local ON Semiconductor Sales
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

Previously Viewed Products
Clear List

Technical Support
   
 

Sign Up for Ongoing PCN Updates!
  ON Semiconductor has partnered with PCNAlert to provide product change and product update notification. This service will automatically notify you of time critical product change and obsolescence information. You can customize your preferences, so you only receive PCNs for products you specify.

This is a complimentary service from ON Semiconductor and PCNAlert.