Product Change Notification
| Change Notification # |
|
16346 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Solder Die Attach for the SOT223 Package |
| Issue Date |
|
2009-10-15 |
| Affected Product Family |
|
|
| Description |
|
This is a Final Product Change Notice for using a soft solder Die attach material for the SOT223 package. The material change will be going from an Epoxy to a Solder for Die attach. This FPCN is being issued for MOSFET, Thyristor, and Smart Discrete products.
|
| Key Items Affected by Change |
|
Die Attach Assembly |
| |
| Key Milestones |
|
| Effective Date: |
|
2009-01-15 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|