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Product Change Notification

Change Notification #   16309
Revision   A
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Trench and HD3e Die Transfer to ON Semiconductor in Aizu, Japan
Issue Date   2009-07-29
Affected Product Family  
Description   This Process Change Notice is the final version to Process Change Notice #16249. PCN #16249 announced that the ON Semiconductor’s Wafer Fab facilities in Aizu, Japan, along with the current Wafer Foundry will both be sources for Trench and High Cell Density Planar MOSFET Die.
Key Items Affected by Change   ON Semiconductor Wafer Fab Site
 
Key Milestones  
Effective Date:   2009-10-29
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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