Product Change Notification
| Change Notification # |
|
16309 |
| Revision |
|
A |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Trench and HD3e Die Transfer to ON Semiconductor in Aizu, Japan |
| Issue Date |
|
2009-07-29 |
| Affected Product Family |
|
|
| Description |
|
This Process Change Notice is the final version to Process Change Notice #16249. PCN #16249 announced that the ON Semiconductor’s Wafer Fab facilities in Aizu, Japan, along with the current Wafer Foundry will both be sources for Trench and High Cell Density Planar MOSFET Die.
|
| Key Items Affected by Change |
|
ON Semiconductor Wafer Fab Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2009-10-29 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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