Product Change Notification
| Change Notification # |
|
16296 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Copper Wire replacing Gold Wire for the SC70, SC75, SC88, SC89 Packages for MOSFET Products |
| Issue Date |
|
2009-07-01 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor is notifying customers of its use of Copper Wire (in place of Gold Wire) for their SC70, SC75, SC88, SC89, and the remaining SOT23 (in reference to PCN #16257) Packaged Products assembled with MOSFET Die. SC70, SC75, SC88, SC89, and SOT23 Products built with Planar and Trench Silicon MOSFET platforms are represented by this Process Change Notice.
Reliability Qualification and full electrical characterization over temperature has been performed.
|
| Key Items Affected by Change |
|
ON Semiconductor SC70, SC75, SC88, SC89 and SOT23 Assembly Areas – Wire Bond |
| |
| Key Milestones |
|
| Effective Date: |
|
2009-09-30 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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|