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Product Change Notification

Change Notification #   16214
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Capacity Expansion Qualification of ON Semiconductor Gresham Wafer Fab for NCP4894FCT1G, NCP4894DMR2G, and NCP4894MNR2G.
Issue Date   2009-02-06
Affected Product Family  
Description   ON Semiconductor is pleased to announce a capacity expansion qualification for the NCP4894 family of audio amplifier products, including NCP4894FCT1G, NCP4894DMR2G, and NCP4894MNR2G part numbers. This device family is currently qualified at the XFAB wafer foundry facilities in Lubbock, Texas (USA) and Erfurt, Germany and is now also qualified at ON Semiconductor’s Gresham wafer fabrication facility located in Gresham, Oregon (USA). Upon expiration (or approval) of this Final PCN, devices may be supplied by either wafer fabrication facility. The Gresham wafer fab is compliant to ISO9001:2000, ISO/TS16949:2002, and ISO14001:2004.
Key Items Affected by Change   ON Semi Fab Site / Subcontractor Fab Site
 
Key Milestones  
Effective Date:   2009-05-06
Sample Info:   Contact your local On Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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