Product Change Notification
| Change Notification # |
|
16184 |
| Revision |
|
|
| Type of Notification |
|
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Copper Wire replacing Gold Wire in the SO8FL Package for MOSFET Products |
| Issue Date |
|
2008-12-12 |
| Affected Product Family |
|
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| Description |
|
ON Semiconductor is notifying customers of its plan to qualify Copper Wire (in place of Gold Wire) on their MOSFET Products in the SO8FL Packages. Products for both the Planar and Trench Silicon platforms will be affected.
The mold compound, die attach, and lead frame materials used for the SO8FL Package will not be changed. Reliability Qualification and full electrical characterization over temperature will be performed for each of the SO8FL products.
The Final PCN will be published upon the successful completion of the Package and Silicon qualification and electrical characterization. The Final PCN will list all the Devices being released, and the Date Code of products which will contain Copper Wire instead of Gold.
|
| Key Items Affected by Change |
|
ON Semiconductor SO8FL Assembly Areas – Gate Wire Bond |
| |
| Key Milestones |
|
| Effective Date: |
|
2009-06-01 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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