Product Change Notification
| Change Notification # |
|
16181 |
| Revision |
|
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| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Capacity Expansion Qualification of ON Semiconductor Gresham Wafer Fab for NCP2990FCT2G |
| Issue Date |
|
2008-11-25 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor is pleased to announce a capacity expansion qualification for NCP2990FCT2G.
This device is currently qualified at the XFAB wafer foundry facility in Lubbock, Texas (USA) and is now also qualified at ON Semiconductor’s Gresham wafer fabrication facility located in Gresham, Oregon (USA). Upon expiration (or approval) of this Final PCN, devices may be supplied by either wafer fabrication facility.
The Gresham wafer fab is compliant to ISO9001:2000, ISO/TS16949:2002, and ISO14001:2004.
|
| Key Items Affected by Change |
|
ON Semi Fab Site / Subcontractor Fab Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2009-02-25 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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