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Product Change Notification

Change Notification #   16121
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Qualification of UAT for Bumped Products
Issue Date   2008-05-26
Affected Product Family  
Description   This is a Final PCN announcing that ON Semiconductor has successfully qualified the UAT facility in Ipoh, Malaysia as an additional source for bump processing of micro-bump devices including NCP2890AFCT2G, NCP2820FCT1G, NCP2820FCT2G, and NCP2990FCT2G. UAT is certified ISO 9001:2000, QS 9000:1998, ISO 14001:2004 and ISO/TS 16949: 2002. Qualification of UAT represents a manufacturing capacity expansion. Upon expiration of this notification, affected devices may be supplied from any of the qualified facilities (ASE-Kaoshiung, Taiwan; Flip Chip International, Phoenix, Arizona; or UAT, Ipoh, Malaysia). This does not require a change in the wafer/die source. As such, device performance and functionality will remain unchanged. Devices will continue to meet all data book specifications and reliability will continue to meet or exceed ON Semiconductor standards.
Key Items Affected by Change   Sub-Contractor Assembly Site
 
Key Milestones  
Effective Date:   2008-08-26
Sample Info:   Sub-Contractor Assembly Site
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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