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Product Change Notification

Change Notification #   16122
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Qualification of Flip Chip International (FCI) for Bumped Products
Issue Date   2008-05-21
Affected Product Family  
Description   This is a Final PCN announcing that ON Semiconductor has successfully qualified the Flip Chip International (FCI) facility in Phoenix, Arizona as an additional source for bump processing of micro-bump devices including NCP2892AFCT2G, NCP2892BFCT2G, NCP4894FCT1G, NCP1523FCT2G, and NCP1523BFCT2G.
Key Items Affected by Change   Sub-Assembly
 
Key Milestones  
Effective Date:   2008-08-21
Sample Info:   Contact your local ON Semiconductor Sales Office or Todd Manes
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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