Product Change Notification
| Change Notification # |
|
16122 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualification of Flip Chip International (FCI) for Bumped Products |
| Issue Date |
|
2008-05-21 |
| Affected Product Family |
|
|
| Description |
|
This is a Final PCN announcing that ON Semiconductor has successfully qualified the Flip Chip International (FCI) facility in Phoenix, Arizona as an additional source for bump processing of micro-bump devices including NCP2892AFCT2G, NCP2892BFCT2G, NCP4894FCT1G, NCP1523FCT2G, and NCP1523BFCT2G.
|
| Key Items Affected by Change |
|
Sub-Assembly |
| |
| Key Milestones |
|
| Effective Date: |
|
2008-08-21 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Todd Manes |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|