Product Change Notification
| Change Notification # |
|
16113 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Die replacement and Manufacturing flow change for ADP3120A, ADP3110A, and ADP3118 |
| Issue Date |
|
2008-04-16 |
| Affected Product Family |
|
|
| Description |
|
This is a Final Process Change Notice to IPCN 16103 located at www.onsemi.com
• ON Semiconductor has acquired the voltage regulation and thermal monitoring products (ADI-PTC) for computing applications from Analog Devices, Inc. Analog Devices will continue to provide the subject products for a limited time period.
• To eliminate supply constraints for the subject products and integrate product manufacturing flow into ON systems.
• The subject products will have change in die process technology and location as well as assembly /test locations. It is believed that the products will continue to meet (or exceed) the current device specifications and that functionality there will be no difference in performance; however samples may be requested for verification.
• As part of the assembly/test location changes, the package outline from LFCSP to DFN changes slightly, but the solderable footprint for board placement is the same.
|
| Key Items Affected by Change |
|
Die, Wafer Fab Process/Location; Assembly/Test Site Change |
| |
| Key Milestones |
|
| Effective Date: |
|
2008-07-16 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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|