Product Change Notification
| Change Notification # |
|
16095 |
| Revision |
|
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| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
NCP4894DMR2G Expansion Into XFAB-Lubbock |
| Issue Date |
|
2008-01-21 |
| Affected Product Family |
|
|
| Description |
|
This is a final process change notice to IPCN #16055. The NCP4894DMR2G device has historically been fabricated at the XFAB facility in Erfurt, Germany, and is now qualified for fabrication at the XFAB facility in Lubbock, TX, USA. All XFAB facilities are certified ISO9001:2000 compliant. XFAB offers the same process technology in both fab locations; no die design or process changes were implemented for this activity. This change is considered a capacity expansion. At the expiration of the FPCN, the NCP4894DMR2G may be processed at either qualified location.
|
| Key Items Affected by Change |
|
Subcontractor FAB Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2008-04-21 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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