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Product Change Notification

Change Notification #   16095
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   NCP4894DMR2G Expansion Into XFAB-Lubbock
Issue Date   2008-01-21
Affected Product Family  
Description   This is a final process change notice to IPCN #16055. The NCP4894DMR2G device has historically been fabricated at the XFAB facility in Erfurt, Germany, and is now qualified for fabrication at the XFAB facility in Lubbock, TX, USA. All XFAB facilities are certified ISO9001:2000 compliant. XFAB offers the same process technology in both fab locations; no die design or process changes were implemented for this activity. This change is considered a capacity expansion. At the expiration of the FPCN, the NCP4894DMR2G may be processed at either qualified location.
Key Items Affected by Change   Subcontractor FAB Site
 
Key Milestones  
Effective Date:   2008-04-21
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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