Product Change Notification
| Change Notification # |
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16076 |
| Revision |
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| Type of Notification |
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PRODUCT BULLETIN |
| Change Title |
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Discontinuance of Dry Pack for NCP1606xDR2G Products |
| Issue Date |
|
2007-12-17 |
| Affected Product Family |
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| Description |
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The NCP1606xDR2G has recently been qualified at MSL 1 @ 260C level. 1 Production lot has passed MSL 1 @ 260C Preconditioning and reliability testing. Results are shown here:
Pre-Conditioned AutoClave – 121C/100%RH/15psig 0/80 at 96hrs
Pre-Conditioned Temp Cycle - -65C to +150C 0/80 at 500cycles
Pre-Conditioned UHAST – 130C/85%RH/18.8psig 0/80 at 96hrs
High Temperature Storage – 150C 0/80 at 504hrs
High Temp Operating Life – Ta = 125C, Vcc = 18V 0/80 at 504hrs
These devices were previously qualified to MSL 3 which required the use of Dry Packaging Techniques. Effective Jan 1, 2008, dry packing will be discontinued for these devices and the products will be shipped per MSL 1 packaging.
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| Key Items Affected by Change |
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| Key Milestones |
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| Effective Date: |
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2008-01-01 |
| Sample Info: |
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| Possible Replacements |
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N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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