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Product Change Notification

Change Notification #   16076
Revision  
Type of Notification   PRODUCT BULLETIN
Change Title   Discontinuance of Dry Pack for NCP1606xDR2G Products
Issue Date   2007-12-17
Affected Product Family  
Description   The NCP1606xDR2G has recently been qualified at MSL 1 @ 260C level. 1 Production lot has passed MSL 1 @ 260C Preconditioning and reliability testing. Results are shown here: Pre-Conditioned AutoClave – 121C/100%RH/15psig 0/80 at 96hrs Pre-Conditioned Temp Cycle - -65C to +150C 0/80 at 500cycles Pre-Conditioned UHAST – 130C/85%RH/18.8psig 0/80 at 96hrs High Temperature Storage – 150C 0/80 at 504hrs High Temp Operating Life – Ta = 125C, Vcc = 18V 0/80 at 504hrs These devices were previously qualified to MSL 3 which required the use of Dry Packaging Techniques. Effective Jan 1, 2008, dry packing will be discontinued for these devices and the products will be shipped per MSL 1 packaging.
Key Items Affected by Change  
 
Key Milestones  
Effective Date:   2008-01-01
Sample Info:  
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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