Product Change Notification
| Change Notification # |
|
16045 |
| Revision |
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| Type of Notification |
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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualification of Flip Chip International (FCI) for Bumped Products |
| Issue Date |
|
2007-09-10 |
| Affected Product Family |
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| Description |
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This is a Final PCN announcing that ON Semiconductor has successfully qualified the Flip Chip International (FCI) facility in Phoenix, Arizona as an additional source for bump processing of micro-bump devices including NCP2820FCT1G, NCP2820FCT2G, and NCP2990FCT2G.
FCI is a fully certified ISO9002 and QS9000 supplier.
There will be no changes in the wafer/die source; therefore, device functionality will be identical to that of the existing production material. Device parameters will continue to meet all Data Book specifications, and reliability will continue to meet or exceed ON Semiconductor standards.
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| Key Items Affected by Change |
|
Sub-Assembly |
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| Key Milestones |
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| Effective Date: |
|
2007-12-10 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Todd Manes |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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