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Product Change Notification

Change Notification #   16045
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Qualification of Flip Chip International (FCI) for Bumped Products
Issue Date   2007-09-10
Affected Product Family  
Description   This is a Final PCN announcing that ON Semiconductor has successfully qualified the Flip Chip International (FCI) facility in Phoenix, Arizona as an additional source for bump processing of micro-bump devices including NCP2820FCT1G, NCP2820FCT2G, and NCP2990FCT2G. FCI is a fully certified ISO9002 and QS9000 supplier. There will be no changes in the wafer/die source; therefore, device functionality will be identical to that of the existing production material. Device parameters will continue to meet all Data Book specifications, and reliability will continue to meet or exceed ON Semiconductor standards.
Key Items Affected by Change   Sub-Assembly
 
Key Milestones  
Effective Date:   2007-12-10
Sample Info:   Contact your local ON Semiconductor Sales Office or Todd Manes
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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