Product Change Notification
| Change Notification # |
|
16037 |
| Revision |
|
|
| Type of Notification |
|
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualification of AIT, Batam, Indonesia for Assembly/Test of LQFP 52/64 LD EP |
| Issue Date |
|
2007-08-30 |
| Affected Product Family |
|
|
| Description |
|
This is an initial Product Change Notice to advise customers of the planned qualification of AIT (Advanced Interconnect Technologies) to assemble and test the LQFP 52/64 lead exposed pad package. This is additional capacity to supplement the current assembly site at ASE located in Taiwan. AIT is QS9000, ISO9002 and TS16949 certified.
AIT is qualified and currently assembling other packages for ON Semiconductor.
|
| Key Items Affected by Change |
|
Subcontractor Assembly/Test Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2007-12-30 |
| Sample Info: |
|
Contact your local ON Semiconductor sales office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|