Product Change Notification
| Change Notification # |
|
16009 |
| Revision |
|
|
| Type of Notification |
|
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Initial Notification for Gold wire changing to Copper wire on SOT-23 commodity parts |
| Issue Date |
|
2007-05-08 |
| Affected Product Family |
|
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| Description |
|
On Semiconductor is notifying customers of its plan to qualify Copper wire on commodity products of Small Signal PNP transistors, Small Signal NPN Transistors, and switching diodes in the SOT-23 package.
The mold compound, die attach, and lead frame materials used in the SOT-23 package will remain the same. A qualification vehicle has been selected for each of the device functions and full electrical characterization over temperature will be performed on each qualification vehicle to ensure device functionality and electrical specifications are met.
Multiple final PCNs will be published, starting in the end of May of 2007, providing the qualification results and 90 days of notice of effective planned production release dates for specific devices. The final PCNs will list the devices being released and the date code which will contain Copper wire instead of Gold.
|
| Key Items Affected by Change |
|
ON Semiconductor assembly – wire bond |
| |
| Key Milestones |
|
| Effective Date: |
|
2007-09-08 |
| Sample Info: |
|
Contact your Local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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