Product Change Notification
| Change Notification # |
|
16002 |
| Revision |
|
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| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Final Notification for SO8-MCM Expansion to OSPI |
| Issue Date |
|
2007-03-28 |
| Affected Product Family |
|
|
| Description |
|
This is the Final Process Change Notice to IPCN 15506 located at www.onsemi.com to notify customers of the capacity expansion of the ON Semiconductor assembly/test location at Carmona, Philippines (OSPI) for 8 lead narrow SOIC MCM (SO-8 Multi Chip Module) packages. The devices listed on this FPCN have historically been assembled or tested at the ASE assembly/test facility located in Chung Li, Taiwan. At the expiration of this Final PCN, these devices may be processed at either location. The ON Semiconductor facility at Carmona, Philippines is fully qualified and has been producing the SOIC narrow body Product for many years.
|
| Key Items Affected by Change |
|
Assembly and Test |
| |
| Key Milestones |
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| Effective Date: |
|
2007-05-28 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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|