Product Change Notification
| Change Notification # |
|
15750 |
| Revision |
|
|
| Type of Notification |
|
UPDATE NOTIFICATION |
| Change Title |
|
Retraction of devices listed on UN 15734 |
| Issue Date |
|
2007-03-20 |
| Affected Product Family |
|
|
| Description |
|
This notice is to retract specific VHVIC devices listed below that were include on Update
Notification #15734 issued on Feb 26 2007. The purpose of the original PCN was to notify
customers that ON Semiconductor is qualifying a new BOM with a different lead frame, die
attach epoxy, and mold compound, to improve the moisture sensitivity level (MSL) for the
SOT223 package. This BOM change will not occur on VHVIC devices. We apologize for
any concern this may have caused.
|
| Key Items Affected by Change |
|
ON Semiconductor Assembly |
| |
| Key Milestones |
|
| Effective Date: |
|
2007-03-20 |
| Sample Info: |
|
N/A |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|