Product Change Notification
| Change Notification # |
|
15550 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
FINAL NOTICE FOR IC T0220 PACKAGE CHANGE TO SINGLE GAGE HEATSINK |
| Issue Date |
|
2006-05-25 |
| Affected Product Family |
|
ANALOG |
| Description |
|
This is the Final PCN to Initial Product Change Notice IPCN#15018 (available at www.onsemi.com) to notify customers the T0220 product lines for IC products running in Seremban, Malaysia have been qualified for a single gage thickness heat sink. The current heat sink has a thickness of .050 inch (1.265 mm). The new heat sink will have a thickness
of .020 inch (.508 mm).
|
| Key Items Affected by Change |
|
Assembly process |
| |
| Key Milestones |
|
| Effective Date: |
|
2006-07-25 |
| Sample Info: |
|
Contact local Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|