Product Change Notification
| Change Notification # |
|
15506 |
| Revision |
|
|
| Type of Notification |
|
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Initial Notification of Qualification of OSPI for Assembly/Test of SO-8 MCM Package |
| Issue Date |
|
2006-04-10 |
| Affected Product Family |
|
DISCRETES |
| Description |
|
Initial Process Change Notice to notify customers of the capacity expansion of the ON Semiconductor assembly/test location at Carmona, Philippines (OSPI) for 8/14/16 lead narrow SOIC packages. The devices listed on this IPCN have historically been assembled/tested at the ASE assembly/test facility located in Chung Li, Taiwan. At the expiration of this Initial PCN and subsequent Final PCN, these devices may be processed at either location. The ON Semiconductor facility at Carmona, Philippines is fully qualified and has been producing the SOIC narrow body products for many years. The capacity expansion will involve duplication of the existing equipment set currently in production
|
| Key Items Affected by Change |
|
ON Semiconductor Assembly and Test |
| |
| Key Milestones |
|
| Effective Date: |
|
2006-08-10 |
| Sample Info: |
|
N/A |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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|