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Product Change Notification

Change Notification #   15506
Revision  
Type of Notification   INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Initial Notification of Qualification of OSPI for Assembly/Test of SO-8 MCM Package
Issue Date   2006-04-10
Affected Product Family   DISCRETES
Description   Initial Process Change Notice to notify customers of the capacity expansion of the ON Semiconductor assembly/test location at Carmona, Philippines (OSPI) for 8/14/16 lead narrow SOIC packages. The devices listed on this IPCN have historically been assembled/tested at the ASE assembly/test facility located in Chung Li, Taiwan. At the expiration of this Initial PCN and subsequent Final PCN, these devices may be processed at either location. The ON Semiconductor facility at Carmona, Philippines is fully qualified and has been producing the SOIC narrow body products for many years. The capacity expansion will involve duplication of the existing equipment set currently in production
Key Items Affected by Change   ON Semiconductor Assembly and Test
 
Key Milestones  
Effective Date:   2006-08-10
Sample Info:   N/A
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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