Product Change Notification
| Change Notification # |
|
14053 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualification of XFAB Texas Wafer Fab for NCP4894, NCP4896 MICRO-BUMPED Devices |
| Issue Date |
|
2005-04-06 |
| Affected Product Family |
|
ANALOG |
| Description |
|
This is a Final PCN (Product Change Notice) to notify customers of
the qualification of the XFAB Texas wafer fab, located in Lubbock,
Texas, as an additional source for the NCP4894 and NCP4896
micro-bumped devices. The devices are currently run in the XFAB
Germany facility, located in Erfurt, Germany. Both XFAB locations
offer the same process technology; therefore, no die design changes
were made.
|
| Key Items Affected by Change |
|
Subcontractor Fab Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2005-06-06 |
| Sample Info: |
|
Yes |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|