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Product Change Notification

Change Notification #   14053
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Qualification of XFAB Texas Wafer Fab for NCP4894, NCP4896 MICRO-BUMPED Devices
Issue Date   2005-04-06
Affected Product Family   ANALOG
Description   This is a Final PCN (Product Change Notice) to notify customers of the qualification of the XFAB Texas wafer fab, located in Lubbock, Texas, as an additional source for the NCP4894 and NCP4896 micro-bumped devices. The devices are currently run in the XFAB Germany facility, located in Erfurt, Germany. Both XFAB locations offer the same process technology; therefore, no die design changes were made.
Key Items Affected by Change   Subcontractor Fab Site
 
Key Milestones  
Effective Date:   2005-06-06
Sample Info:   Yes
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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